Profile
Overview
Customer Base
FAQ

This overview is intended to whet the appetite; we would welcome your call if you need any advice, assistance or to discuss any requirement you may have.

If you have any speculative or general questions about pcb design you will find us very willing to help.

• Design technology: High power, high speed with controlled impedance and matched length constraints, analogue, digital, mixed signal, RF, safety critical / intrinsically safe.

• Markets: Networking and Telecommunications - Industrial Control and Automation - Test and Measurement - Medical - Aerospace and Defence - Automotive and Transport systems - Multimedia and Broadcast - Oil and Gas.

• Electronic architectures: DDR - DDR2 - DDR3 - RocketIO™ - Serial RapidIO® - SGMII - RGMII - SCSI - SATA.

• Packaging technology:  Fine pitch BGAs (0.4mm, 0.5mm, 0.8mm) - Chip Scale Packaging - High pin count BGAs (1150+).

• Manufacturing technology:  High Density Interconnect (HDI) / Sequential Buildup (SBU) and microvias , exotic materials, via in pad, copper filled vias.

• Form Factors: AdvancedMC® (AMC) for microTCA® and AdvancedTCA®, PCI, Compact PCI, PCI Express, PMC, XMC, PC104,
  plus other Open Standards.